HISOMET is a machine that i used the most in my working life.
This is because HISOMET is used for :
(a) 1st bond placement measurement
(b) 2nd bond placement measurement
(c) Loop height
(d) Ball-bonded Height (BBD)
(e) Ball- bonded Diameter(BBH)
Let's talk about what is 1st bonded placement... ...
The two Cpk's will use actual measurements of the cone size, squashed ball size from the same ball bonds :
(a) Benchmark
The 2 photos show how I measure the cone size value for the left hand side, and same step will be done in right hand side.
The value that I get will use to get the Benchmarking Cpk.
(b) Internal
While this 2 photos show how I measure the squashed size value for the left hand side, and same step will be done in right hand side.
The value that I get will use to get the Internal Cpk.
In order to capture the range of the wire bond placement capability as fully as possible, there are a few considerations i have to take note in selecting which ball bonds to be measure :
1. Different groupings of wires
Select ball bonds created from different groupings of wires
2. Different side of the dice
Ball bonds from all four sides of the dice should be included
3. Location of dice on substrate strip
Select dice that are far apart from each other on the substrate strip to measure the placement variation
4. Strip
Select strips that were wire bonded at different times within an assembly lot. For example, select first strip. middle strip and last strip of a magazine
----------------------------------------To Be Continue--------------------------------------
This is because HISOMET is used for :
(a) 1st bond placement measurement
(b) 2nd bond placement measurement
(c) Loop height
(d) Ball-bonded Height (BBD)
(e) Ball- bonded Diameter(BBH)
Let's talk about what is 1st bonded placement... ...
The two Cpk's will use actual measurements of the cone size, squashed ball size from the same ball bonds :
(a) Benchmark
The 2 photos show how I measure the cone size value for the left hand side, and same step will be done in right hand side.
The value that I get will use to get the Benchmarking Cpk.
(b) Internal
While this 2 photos show how I measure the squashed size value for the left hand side, and same step will be done in right hand side.
The value that I get will use to get the Internal Cpk.
In order to capture the range of the wire bond placement capability as fully as possible, there are a few considerations i have to take note in selecting which ball bonds to be measure :
1. Different groupings of wires
Select ball bonds created from different groupings of wires
2. Different side of the dice
Ball bonds from all four sides of the dice should be included
3. Location of dice on substrate strip
Select dice that are far apart from each other on the substrate strip to measure the placement variation
4. Strip
Select strips that were wire bonded at different times within an assembly lot. For example, select first strip. middle strip and last strip of a magazine
----------------------------------------To Be Continue--------------------------------------
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