Overall Process
The process flow for the chips from the front end to the back end and ultimately to the customers..
(a) Wafer is Built
This is the process where the wafer is formed by many dies and it is in a round shape)
(b) Wafer Mount
To stick wafer on a tape with ring
(c) Wafer Saw
To cut off the dies individually
(d) Die Bond
To bond the die on the substrate using epoxy
(e) Plasma Cleaning
To clean the substrate with plasma that carried out by Argon(physically) ans Oxygen(Chemically)
(f) Wire Bond
To connect the gold wire from the bond pad of the die to the lead finger on the substrate
(g) Plasma Cleaning Repeated
To clean the bonding part with plasma
(h) Mold
To liquified mold compound fills the cavities around the die
(i) Post Cure
To molded material sent for further curing in an oven
(g) Solder Ball
The balls are soldered on the back of the substrate on the specific location
(h) Reflow Cure
Heat the soldered ball for better cAontact with substrawte
(i) Laser Marking
Mark the components with model number
(j) Singulation
Cut the strips into a single unit of the substrate
(k) Shipping
To ship the product to the customer
The process flow for the chips from the front end to the back end and ultimately to the customers..
(a) Wafer is Built
This is the process where the wafer is formed by many dies and it is in a round shape)
(b) Wafer Mount
To stick wafer on a tape with ring
(c) Wafer Saw
To cut off the dies individually
(d) Die Bond
To bond the die on the substrate using epoxy
(e) Plasma Cleaning
To clean the substrate with plasma that carried out by Argon(physically) ans Oxygen(Chemically)
(f) Wire Bond
To connect the gold wire from the bond pad of the die to the lead finger on the substrate
(g) Plasma Cleaning Repeated
To clean the bonding part with plasma
(h) Mold
To liquified mold compound fills the cavities around the die
(i) Post Cure
To molded material sent for further curing in an oven
(g) Solder Ball
The balls are soldered on the back of the substrate on the specific location
(h) Reflow Cure
Heat the soldered ball for better cAontact with substrawte
(i) Laser Marking
Mark the components with model number
(j) Singulation
Cut the strips into a single unit of the substrate
(k) Shipping
To ship the product to the customer
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