(b) Second Bond Placement
Basically,this is the placement of the crescent of the second wire bond with respect to its designated substrate bond post.
The Photos show how the measurement have been done:
1. Place the green line on the left of the pad
2. Move the green line by rotate the X-axis.By doing so, i can get X1 value.
3. To find X2, same procedures have been done as step1&2 on the right side.
Crescent Width, W= PW-(x1+x2)
(c) Loop Height
This test should be repeated for each grouping. For different grouping of wires, there are the specific limit for the wire. If the measurement is not within the limit, it is consider failed.
Cross-section view for different grouping of bonded wires:
Layer1 - Ground
Layer2- Power Ring 1
Layer3- Power Ring 2
Layer4- Inner Bond Post
Layer 5- Outer Bond Post
(d) Ball-Bonded Diameter(BBD) & (e) Ball Bonded Height (BBH)
Normally, this two measurement will be found at the same time.
The purpose for the test is to evaluate the shape and dimensions of the ball formed
BBD:
1. Measure the gold ball diameter(x&y axis) by setting the red cross line at the edge of the ball.
Photo show the red line is putting at the left side and the bottom side of the bonded ball.
2. Then, it is move from left to right and bottom to up.
THE END ~HIsOmET~!
Basically,this is the placement of the crescent of the second wire bond with respect to its designated substrate bond post.
The Photos show how the measurement have been done:
1. Place the green line on the left of the pad
2. Move the green line by rotate the X-axis.By doing so, i can get X1 value.
3. To find X2, same procedures have been done as step1&2 on the right side.
Crescent Width, W= PW-(x1+x2)
(c) Loop Height
This test should be repeated for each grouping. For different grouping of wires, there are the specific limit for the wire. If the measurement is not within the limit, it is consider failed.
Cross-section view for different grouping of bonded wires:
Layer1 - Ground
Layer2- Power Ring 1
Layer3- Power Ring 2
Layer4- Inner Bond Post
Layer 5- Outer Bond Post
(d) Ball-Bonded Diameter(BBD) & (e) Ball Bonded Height (BBH)
Normally, this two measurement will be found at the same time.
The purpose for the test is to evaluate the shape and dimensions of the ball formed
BBD:
1. Measure the gold ball diameter(x&y axis) by setting the red cross line at the edge of the ball.
Photo show the red line is putting at the left side and the bottom side of the bonded ball.
2. Then, it is move from left to right and bottom to up.
THE END ~HIsOmET~!
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