Department~
I have been assigned to work under Research & Development (R&D) department which mainly dealing with design of new package of semiconductor and test technology department.
Supervisor~
Every trainee in Freescale will be assigned to work under an engineer. My supervisor is Mr.Lee Boon Seong who are a Process Development Engineer. Hence, my job scope is basically conduct on the reliability and performance test.
Working Place~
The first day reporting to the company, i have tour around the company and Technology Solution Organization(TSO). This is the lab where most of my work done. There are HISOMET and DAGE MACHINE. Different equipments provide different function such as inspection,testing, cross sectioning and other tasks. Moreover, the wire pull and wire peel task also have to be done in this lab.
Figure above shows the hisomet machine which is used to do measurement on the placement of the wire bonding with the substrate.
Hisomet Result will be display on this screen
The X, Y axis are used to find the 1st bond and second bond placement on the substrate.
On the other hand, Z axis is used to measure the height of the wire bond.
Measurement unit shown in either mm or inch.
Last but not least, figure below shows a dage machine that used to do wire pull, wire peel and ball shear test.
I have been assigned to work under Research & Development (R&D) department which mainly dealing with design of new package of semiconductor and test technology department.
Supervisor~
Every trainee in Freescale will be assigned to work under an engineer. My supervisor is Mr.Lee Boon Seong who are a Process Development Engineer. Hence, my job scope is basically conduct on the reliability and performance test.
Working Place~
The first day reporting to the company, i have tour around the company and Technology Solution Organization(TSO). This is the lab where most of my work done. There are HISOMET and DAGE MACHINE. Different equipments provide different function such as inspection,testing, cross sectioning and other tasks. Moreover, the wire pull and wire peel task also have to be done in this lab.
Figure above shows the hisomet machine which is used to do measurement on the placement of the wire bonding with the substrate.
Hisomet Result will be display on this screenThe X, Y axis are used to find the 1st bond and second bond placement on the substrate.
On the other hand, Z axis is used to measure the height of the wire bond.
Measurement unit shown in either mm or inch.
Last but not least, figure below shows a dage machine that used to do wire pull, wire peel and ball shear test.
Post a Comment