Wire Bonding
"What is wire bonding?" This is the first question and the only question that most of us will ask our supervisor the most.
So, what is wire bonding?
Wire bonding is the process of providing electrical connection between the silicon chip and the external leads of the semiconductor devices using bonding wires.
Normally, wire usually used for the wire bonding is gold wire, aluminum wire and the copper wire.
There are 2 types of bond methods:
(a) ball stitch
(b) wedge stitch
3 types of methods for imparting the requisite energy to attach wire to the bond site are :
(a) thermocompression (T/C)
(b) thermosonic (T/S)
(c) ultrasonic (U/S)
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