Wire Bonding Process
I am supporting my supervisor which is using gold wire for wire bonding. To let me have an overall idea about the wire bonding process, my supervisor had bring me to walk around the production line mainly to produce Plastic Ball Grid Array (PBGA) and Tape Ball Grid Array (TBGA).
For PBGA, the balls are soldered on the back of the substrate on the specific location.
While for TBGA, the solder ball is place around the die and not on the back of the substrate.
**The entire work done in the production line need to wear Smock Suit.
Features of Smock suit coverall:
1. Drop away electrostatic charge of human body
2. Friction voltage can be lower than 20V
3. It doesn't produce dust, doesn't absorb dust
4. Dressing comfortably, wash-fast, resistant to alkali and acid
Basically, wire bonding process is where a gold wire is use to connect the bond pad on the die to the substrate on the lead.
The process operate in the line include:
(a)Substrate Preparation (to remove moisture on the substrate- pre cure for 150 Celcius)
(b)Wafer Preparation
- Wafer Dicing/ Wafer Sawing
- Die Attach
- Oven bake
- Plasma Cleaning
(c) Wire Bonding
I am supporting my supervisor which is using gold wire for wire bonding. To let me have an overall idea about the wire bonding process, my supervisor had bring me to walk around the production line mainly to produce Plastic Ball Grid Array (PBGA) and Tape Ball Grid Array (TBGA).
For PBGA, the balls are soldered on the back of the substrate on the specific location.
While for TBGA, the solder ball is place around the die and not on the back of the substrate.
**The entire work done in the production line need to wear Smock Suit.
Features of Smock suit coverall:
1. Drop away electrostatic charge of human body
2. Friction voltage can be lower than 20V
3. It doesn't produce dust, doesn't absorb dust
4. Dressing comfortably, wash-fast, resistant to alkali and acid
Basically, wire bonding process is where a gold wire is use to connect the bond pad on the die to the substrate on the lead.
The process operate in the line include:
(a)Substrate Preparation (to remove moisture on the substrate- pre cure for 150 Celcius)
(b)Wafer Preparation
- Wafer Dicing/ Wafer Sawing
- Die Attach
- Oven bake
- Plasma Cleaning
(c) Wire Bonding
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