*NeW LiFE*

Wire pull And Wire Peel Steps


When I do the wire pull and wire peel test, there might be different failure mode.


Hence, while doing the testing I have to observe the failure mode at the same time and record it.


Some failure Mode may cause by the hook I using was bent, the pull & peel speed, the bonding parameter and etc...



The table for the failure mode is same for both wire pull and wire peel test!!

The step in doing the wire pull test

1. The wire pull hook was placed at the first kink (at the highest point along the loop of the wire), then the bonded wire was pulled away from the die with the hook.
2. The pulling force is usually applied perpendicular to the die surface. The breaking force is measured in gram.
3. Readings, types and pictures of failure mode are recorded

The steps in doing wire peel test

1. The hook is placed as close to the standardized position at the edge of the second bond pad as possible so that the failure will be at the second bond.

2. Normally wire bond at the corner of the chips will be chosen. This is due to the corner wire bonded is longest, hence weakest strength.

3. Readings, types of failure modes and pictures of failures was recorded. The failure modes are same as wire pull failure modes.

The wire at 2^nd bond before wire peel test (top) and after wire peel test (bottom)

The photos below show the failure mode that may cause in the task, the photos in taken by using HISOMET :

From left to right : Lifted Ball. Break at Neck, Lifted Metal