Who is my partner?
A girl? a Guy? oOps, is a machine actually....
It is named as Dage Machine!!!
As what i mentioned before, dage machine is used for wire pull,wire peel and bond shear test.
The result i get from the wire pull and wire peel test are used for further analysis about the wire bond strength at the weakest point.
While the bond test is for the evaluation and control of wire bond quality.
How should i construct the machine ??
This is the steps involve for ball shear test:
(a) Substrate manually placed on fitting plate
(b) Vacuum / window clamp holding by clicking "vacuum" in the program
(C) Loading of shear system and program
(d) Adjustment of tool in place of shearing
- 2 controller(black color) :on the left side is used to control the fitting plate (left & right)
on the right side is use to control the shear tool/hook ( up&down)
(e) Press T, then the program will launch for automatic shears with specified programmable shear speed and sheer height.
(f) Shear operation
(g) Shear tool move up(0.15mm) then back to initial position
(h) Data for each side of a unit are recorded
For the wire pull and wire peel test, the way i construct the machine is almost the same. BUT....
the main difference things is...it is using a hook and not a shear tool...
The difference between the wire pull and wire peel test is:
For the wire pull test, the hook will placed at the first kink ( at the highest point along the loop of the wire), then the bonded wire will pull away from the die with the hook.
For the wire peel test, the hook is place at the edge of the second bond pad ( * Corner part is the first choice to do this test because the wire at the corner is longest, hence the strength is the weakest)
A girl? a Guy? oOps, is a machine actually....
It is named as Dage Machine!!!
As what i mentioned before, dage machine is used for wire pull,wire peel and bond shear test.
The result i get from the wire pull and wire peel test are used for further analysis about the wire bond strength at the weakest point.
While the bond test is for the evaluation and control of wire bond quality.
How should i construct the machine ??
This is the steps involve for ball shear test:
(a) Substrate manually placed on fitting plate
(b) Vacuum / window clamp holding by clicking "vacuum" in the program
(C) Loading of shear system and program
(d) Adjustment of tool in place of shearing
- 2 controller(black color) :on the left side is used to control the fitting plate (left & right)
on the right side is use to control the shear tool/hook ( up&down)
(e) Press T, then the program will launch for automatic shears with specified programmable shear speed and sheer height.
(f) Shear operation
(g) Shear tool move up(0.15mm) then back to initial position
(h) Data for each side of a unit are recorded
For the wire pull and wire peel test, the way i construct the machine is almost the same. BUT....
the main difference things is...it is using a hook and not a shear tool...
The difference between the wire pull and wire peel test is:
For the wire pull test, the hook will placed at the first kink ( at the highest point along the loop of the wire), then the bonded wire will pull away from the die with the hook.
For the wire peel test, the hook is place at the edge of the second bond pad ( * Corner part is the first choice to do this test because the wire at the corner is longest, hence the strength is the weakest)
December 6, 2011 at 9:10 AM
how interesting is it ! have you been there with Freescal company?